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UV-LEDs (Flip-Chip)

Never again chipbonding. With innovative chip scale technology it is possible to equip UV-LED flip chips without wire bonding. The flip chips can be reflow soldered like SMD LEDs. This technology is particularly suitable in the printing industry where high light output is required. Currently the flip chips are available in the wavelengths 385nm, 395nm and 405nm.
UV-LEDs (Flip-Chip)
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Product Manufacturer Wave Length UV Range Radiant Flux typ. Spectrum Half Width If Forward Voltage View Angle Package Dimensions Chassis Length Width Min. operating temperature Max. operating temperature
Note Merkzettel
Artikel Manufacturer Wave Length UV Range Radiant Flux typ. Spectrum Half Width If Forward Voltage View Angle Package Dimensions Chassis Length Width Min. operating temperature Max. operating temperature
NM-UW1111-EB-385
NM-UW1111-EB-385
UV-A LED Flip Chip | 385 nm | WICOB
Seoul Viosys 385 nm UV-A 710 mW 12 nm 500 mA 3.5 V 140 ° 1,1x1,1 mm Chips 1.1 mm 1.1 mm -10 °C 85 °C
NM-UW1111-EB-395
NM-UW1111-EB-395
UV-A LED Flip Chip | 395 nm | WICOB
Seoul Viosys 395 nm UV-A 825 mW 12 nm 700 mA 3.3 V 140 ° 1,1x1,1 mm Chips 1.1 mm 1.1 mm -10 °C 85 °C
NM-UW1111-EB-405
NM-UW1111-EB-405
UV-A LED Flip Chip | 405 nm | WICOB
Seoul Viosys 405 nm UV-A 855 mW 12 nm 400 mA 3.3 V 140 ° 1,1x1,1 mm Chips 1.1 mm 1.1 mm -10 °C 85 °C
Hint: current revision of the supplier datasheet is applicable

Design-In Support

Do you have questions about our UV-LEDs (Flip-Chip) products or are you looking for alternatives? As an authorized distributor, we maintain a very close exchange with our manufacturers and will be happy to advise you on the selection of suitable components and possible adaptations with our many years of experience. Talk to us!
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Our UV-LEDs (Flip-Chip)-Manufacturer

Brochures, flyers and presentations

UV-Technology
  PDF   | Sites: 28 | 3 MB
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LED Components
  PDF   | Sites: 12 | 3.1 MB
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Showroom for UV-LED applications from Seoul Viosys
With the new showroom of Seoul Visosys/Violeds, Violeds offers a perfect overview of the application possibiliti...
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