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ESPROS Photonics AG

The Swiss semiconductor manufacturer ESPROS Photonics AG, headquartered in Sargans, offers an extensive range of optoelectronic components for industrial applications. The portfolio includes photodiodes and photodiode arrays, line sensors, 3D time-of-flight sensor chips and camera modules. These components form the heart of an optical sensor system and form the basis for a variety of applications in the automotive, industrial and consumer goods industries. Autonomous vehicles, drones and robots are just a few examples in which these components are already being used successfully.

All optoelectronic components from Espros Photonics AG are based on a unique combination of CCD and CMOS structures, resulting in unmatched sensitivity and space-saving dimensions. As a technological leader in this field, Espros continuously invests in the development of new and innovative products. Convince yourself of the outstanding performance and quality of our products.

Design-In Support
As an authorized distributor of ESPROS Photonics AG we are at your disposal as a contact person for all questions concerning ESPROS Photonics AG products. We are happy to advise you with our many years of experience in the selection of suitable components and possible adjustments. Contact us. We are here for you.

Flyer with products from ESPROS Photonics AG

ESPROS Photonics AG News

Cliff detection with 3D time-of-flight imager from ESPROS
Today's best robot vacuums are full of high-tech features. Connected to WiFi they can be controlled by smartphone and even via a voice assistant. The combination of many sensors and software allows to drive around obstacles, map the rooms and plan the most economic cleaning path...
Distance measurement made easy with TOF range 611
With the TOF>range 611 of the Swiss photonic specialist Espros distances up to 15m can be measured...
Miniature ToF imager TOF frame 611 with improved performance
For the 8x8 pixel miniature time-of-flight imager module TOF>frame 611 of the Swiss photonics specialist Espros the range could be increased from 2m to 3m by improved calibration and compensation algorithms. The module has...
TOF CAM 635 - Easy and cost-effective introduction to TOF technology
The time-of-flight technology is gaining more and more importance in the field of 3D imaging. However, the development of a ToF camera requires extensive know-how regarding optics, illumination and signal processing. With the new TOF>cam 635 from the Swiss photonics specialist ESPROS Photonics Corporation, these time-consuming and cost-intensive hardware engineering tasks have already been solved and a cost-effective and powerful 3D time-of-flight camera module is available to the user...
Time-of-Flight (ToF) Imager epc611
At the end of 2017, ESPROS Photonics AG introduced the new Time-of-Flight (ToF) Imager epc611. It has an 8x8 pixel CCD photodiode array and is available as usual in a chip-scale BGA package. The pixel size is 20um x 20um, resulting in an active area of ​​160um x 160um...
SPM64 - Multispectral Sensors
With the SPM64 - multispectral sensor developer kit - the Swiss semiconductor manufacturer ESPROS PHOTONICS AG offers another product based on its own Backside Illumination (BSI) manufacturing process.
Time-of-flight chip with 160 x 60 pixels
With the epc635, the Swiss semiconductor manufacturer ESPROS Photonics AG has launched another time-of-flight chip. This chip has a resolution of 160x60 pixels and is also based on BSI's own manufacturing process.
Photodiode Arrays
Highly sensitive photodiode arrays for optical sensors, light barriers and light curtains. With an extremely small footprint, a chip thickness of only 50μm - the ideal choice for the miniaturization of your sensor system!
The epc photodiodes are scalable and can be adapted in size exactly to your application. All rectangular shapes from 1mm x 1mm up to 15mm x 15mm are possible. Within a 1mm x 1mm grid the grating can be used as a large photodiode or any photodiode independently.
Neumüller signs distribution agreement with ESPROS Photonics AG
Neumüller Elektronik GmbH is expanding its product portfolio with products from the Swiss semiconductor manufacturer ESPROS Photonics AG. With their new process technology, extremely small package shapes can be realized in CS packages (chip-scale packages). Conventional packages are no longer necessary.

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