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The demands placed on modern robotics and automation systems are increasing rapidly – whether in healthcare, industry, or mobility. With the new epc670 ToF imager, ESPROS presents a powerful solution for…
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Are you a system integrator? Is your business industrial control, logistics, warehouse automation, mobile and stationary robotics? And are you tired of getting slow frame rates from your SPAD sensor?…
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Today's best robot vacuums are full of high-tech features. Connected to WiFi they can be controlled by smartphone and even via a voice assistant. The combination of many sensors and software allows to drive…
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With the TOF>range 611 of the Swiss photonic specialist Espros distances up to 15m can be measured…
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For the 8x8 pixel miniature time-of-flight imager module TOF>frame 611 of the Swiss photonics specialist Espros the range could be increased from 2m to 3m by improved calibration and compensation algorithms.…
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The time-of-flight technology is gaining more and more importance in the field of 3D imaging. However, the development of a ToF camera requires extensive know-how regarding optics, illumination and signal…
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At the end of 2017, ESPROS Photonics AG introduced the new Time-of-Flight (ToF) Imager epc611. It has an 8x8 pixel CCD photodiode array and is available as usual in a chip-scale BGA package. The pixel size is…
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With the SPM64 - multispectral sensor developer kit - the Swiss semiconductor manufacturer ESPROS PHOTONICS AG offers another product based on its own Backside Illumination (BSI) manufacturing process…
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With the epc635, the Swiss semiconductor manufacturer ESPROS Photonics AG has launched another time-of-flight chip. This chip has a resolution of 160x60 pixels and is also based on BSI's own manufacturing…
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The announced TOF - Time of Flight Camera Chip of the Swiss semiconductor manufacturer ESPROS Photonics AG offers a higher performance and optimal application in various applications.<br><br>The TOF chip with…
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The epc600 is a monolithic, highly integrated photoelectric CMOS device for optical distance measurement and object recognition. The chip measures 2.65mm x 2.65mm and is based on the 3D 'Time-of-Flight' (TOF)…
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Highly sensitive photodiode arrays for optical sensors, light barriers and light curtains. With an extremely small footprint, a chip thickness of only 50μm - the ideal choice for the miniaturization of your…
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