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UV-LED (Flip-Chip)


UV-LED (Flip-Chip)
Never again chipbonding. With innovative chip scale technology it is possible to equip UV-LED flip chips without wire bonding. The flip chips can be reflow soldered like SMD LEDs. This technology is particularly suitable in the printing industry where high light output is required. Currently the flip chips are available in the wavelengths 385nm, 395nm and 405nm.
  • Seoul Viosys
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  • Wave Length [nm]
  • If [mA]
  • Package Dimensions [mm]
  • Radiant Flux typ. [mW]
  • View Angle [°]
  • Forward Voltage [V]
  • Manufacturer
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Product Manufacturer Wave Length [nm] If [mA] Package Dimensions [mm] Radiant Flux typ. [mW] Spectrum Half Width [nm] View Angle [°] Forward Voltage [V]
Note Merkzettel
Artikel Manufacturer Wave Length [nm] If [mA] Package Dimensions [mm] Radiant Flux typ. [mW] Spectrum Half Width [nm] View Angle [°] Forward Voltage [V]
NM-UW1111-EB-385 Seoul Viosys 385 500 1,1 x 1,1 710 12 140 3.5
NM-UW1111-EB-395 Seoul Viosys 395 700 1,1x1,1 825 12 - 3.3
NM-UW1111-EB-405 Seoul Viosys 405 400 1,1x1,1 855 12 - 3.3
Hint: current revision of the supplier datasheet is applicable
Design-In Support
Do you have questions about our UV-LED (Flip-Chip) products or are you looking for alternatives? As an authorized distributor, we maintain a very close exchange with our manufacturers and will be happy to advise you on the selection of suitable components and possible adaptations with our many years of experience. Talk to us!
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