
FEMC032GCE
- Complies with JEDEC eMMC 4.2/4.3/4.4/4.5/5.0/5.1 specifications
- Supports High Speed Mode HS400
- Uses standard JEDEC 153-ball FBGA packaging
- Low Power Management
- Advanced NAND management
- CE, FCC Certified, Passed the 1 Gy X-ray test
- Up to AEC Q100 Grade 2 (-40C-105C)
- Series XTRA VII
- Form Factor 153-ball
- Memory Type 3D pSLC
- Interface eMMC 5.1
- Capacity 32GB
- Write Performance 255 MB/s
- Read Performance 320 MB/s
- Industrie Yes
- Hi-Rel Yes
- Length 13 mm
- Width 11.5 mm
- Height 1 mm
- Min. operating temperature -40 °C
- Max. operating temperature 85 °C
- Weight 0.01 g
Services
We support you in every phase of your project. From the initial idea to series production, we accompany you with expertise, state-of-the-art technology, and customized solutions.
Why customers rely on us
For decades, we have been supporting our customers with tailor-made solutions, technical expertise, and personal service. This trust forms the basis for successful, long-term partnerships.
Whether standard or custom solutions -
we deliver exactly what you need.
Distribution, development, production -
comprehensive service from a single source.
Future technologies in use
for modern solutions with vision.
Reliable support right from the start -
on site, via call, or by phone.
Successful on the market since 1952
with in-depth industry expertise.
Manufacturer expertise directly available
for development, innovation & optimization
High system integration with a concept
for efficiency and reduced complexity.
Know-how and experience combined
for sustainable electronics solutions.
Responsible and resource-conscious
selection of components and supply chains.
Predictable prices and supply -
tailored to your individual needs.
Certified processes for maximum
safety, quality, and compliance.
Kanban, consignment, min-max, and more
for availability and less inventory.
Customers who
trust us.




