
eMMC
eMMC storage with JEDEC eMMC 5.1 features for mobile, industrial and embedded applications. Available in 100 BGA and 153 BGA packages with different capacities. eMMC combines controller and flash in one compact solution and is suitable for boot, code and data storage in robust series products.

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| Alliance Memory | ASFC | 153-ball | MLC | eMMC 5.1 | 4GB | 50 MB/s | 120 MB/s | 2.7 - 3.6 V | Yes | No | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| Alliance Memory | ASFC | 153-ball | MLC | eMMC 5.1 | 8GB | 50 MB/s | 120 MB/s | 2.7 - 3.6 V | Yes | No | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| Flexxon | ECON II | 153-ball | MLC | eMMC 5.1 | 4GB | 120 MB/s | 170 MB/s | – | Yes | No | – | – | – | -25 °C | 85 °C | 0.01 g | |
| Flexxon | ECON II | 153-ball | MLC | eMMC 5.1 | 8GB | 120 MB/s | 170 MB/s | – | Yes | No | – | – | – | -25 °C | 85 °C | 0.01 g | |
| Flexxon | XTRA VII | 153-ball | 3D pSLC | eMMC 5.1 | 8GB | 130 MB/s | 320 MB/s | – | Yes | Yes | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| Flexxon | XTRA VII | 153-ball | 3D pSLC | eMMC 5.1 | 8GB | 130 MB/s | 320 MB/s | – | Yes | Yes | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | – | |
| Flexxon | ECON II | 153-ball | MLC | eMMC 5.1 | 16GB | 120 MB/s | 170 MB/s | – | Yes | No | – | – | – | -25 °C | 85 °C | 0.01 g | |
| Flexxon | XTRA VII | 153-ball | 3D TLC | eMMC 5.1 | 16GB | 130 MB/s | 320 MB/s | – | Yes | Yes | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| Flexxon | XTRA VII | 153-ball | 3D pSLC | eMMC 5.1 | 16GB | 255 MB/s | 320 MB/s | – | Yes | Yes | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| Flexxon | ECON II | 153-ball | 3D TLC | eMMC 5.1 | 32GB | 120 MB/s | 170 MB/s | – | Yes | No | – | – | – | -25 °C | 85 °C | 0.01 g | |
| Flexxon | XTRA VII | 153-ball | 3D TLC | eMMC 5.1 | 32GB | 130 MB/s | 320 MB/s | – | Yes | Yes | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| Flexxon | XTRA VII | 153-ball | 3D pSLC | eMMC 5.1 | 32GB | 255 MB/s | 320 MB/s | – | Yes | Yes | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| Flexxon | ECON II | 153-ball | 3D TLC | eMMC 5.1 | 64GB | 120 MB/s | 170 MB/s | – | Yes | No | – | – | – | -25 °C | 85 °C | 0.01 g | |
| Flexxon | XTRA VII | 153-ball | 3D TLC | eMMC 5.1 | 64GB | 240 MB/s | 320 MB/s | – | Yes | Yes | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| Flexxon | XTRA VII | 153-ball | 3D TLC | eMMC 5.1 | 128GB | 245 MB/s | 320 MB/s | – | Yes | Yes | 13 mm | 11.5 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE340 | 153-ball | MLC | eMMC 5.1 | 4GB | 10 MB/s | 170 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 0.8 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | 3D TLC | eMMC 5.1 | 16GB | 15 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | pSLC | eMMC 5.1 | 5GB | 140 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | 3D TLC | eMMC 5.1 | 16GB | 15 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | 3D TLC | eMMC 5.1 | 32GB | 15 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | pSLC | eMMC 5.1 | 10GB | 140 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | 3D TLC | eMMC 5.1 | 32GB | 15 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | pSLC | eMMC 5.1 | 10GB | 140 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | 3D TLC | eMMC 5.1 | 64GB | 25 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | pSLC | eMMC 5.1 | 20GB | 250 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | 3D TLC | eMMC 5.1 | 64GB | 25 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | 3D TLC | eMMC 5.1 | 128GB | 45 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | pSLC | eMMC 5.1 | 40GB | 275 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 153-ball | 3D TLC | eMMC 5.1 | 128GB | 45 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 11.5 mm | 13 mm | 1 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | 3D TLC | eMMC 5.1 | 16GB | 15 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | pSLC | eMMC 5.1 | 5GB | 140 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | 3D TLC | eMMC 5.1 | 16GB | 15 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | 3D TLC | eMMC 5.1 | 32GB | 15 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | pSLC | eMMC 5.1 | 10GB | 140 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | 3D TLC | eMMC 5.1 | 32GB | 15 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | pSLC | eMMC 5.1 | 10GB | 140 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | 3D TLC | eMMC 5.1 | 64GB | 25 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | pSLC | eMMC 5.1 | 20GB | 250 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | 3D TLC | eMMC 5.1 | 128GB | 45 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g | |
| SMART Modular Technologies | BGAE540 | 100-ball | pSLC | eMMC 5.1 | 40GB | 275 MB/s | 340 MB/s | 2,7-3,6 V | Yes | Yes | 14 mm | 18 mm | 2.45 mm | -40 °C | 85 °C | 0.01 g |
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