EPC670 - Time-of-flight chip for high-resolution, long-range 3D sensing

Precise 3D sensor technology for the robotics of the future

The demands placed on modern robotics and automation systems are increasing rapidly – whether in healthcare, industry, or mobility.

With the new epc670 ToF imager, ESPROS presents a powerful solution for precise, fast, and reliable 3D environment detection – developed for the next generation of robotics, autonomous systems, and security applications.

The Future of Sensor Technology

The epc670 is a fully integrated QVGA continuous wave time-of-flight imager optimized for high-speed, long-range 3D detection. With a resolution of 320 × 240 pixels and integrated control logic on the chip, it delivers 12-bit distance data (DCS) via a standardized MIPI interface – ready for seamless system integration.

Thanks to its exceptional sensitivity, the epc670 enables precise depth measurements with low illumination and full eye safety compliance. With a frame rate of up to 700 full frames per second, the epc670 combines performance, efficiency, and compactness—ideal for the next generation of 3D cameras and embedded vision systems.

It combines maximum light sensitivity with robust outdoor performance. It delivers up to 54 million 3D data points per second – with millimeter accuracy up to a range of 20 m. Thanks to state-of-the-art OHC15L imager technology with 72% quantum efficiency (QE) at 905 nm, it is unbeatable even in sunlight.

Typical areas of application:

• Mobile service and care robots
• Autonomous vehicles and drones
• Industrial automation and security monitoring
• Smart healthcare and activity monitoring
• Outdoor and traffic monitoring systems

ESPROS is part of a national Swiss initiative to establish a chip FabLab in the Zurich Innovation Park, which is driving forward state-of-the-art semiconductor development for robotics, satellite communication, and autonomous systems. This will enable Europe to remain technologically competitive – with solutions such as the epc670, which combine precision, efficiency, and sustainability.

Technical highlights:

• Highly sensitive CCD pixel architecture
• True 4-phase demodulation per pixel for precise distance measurements
• Fully integrated analog front end and digital readout section
• Noise reduction and temperature compensation directly on the chip
• Excellent ambient light resistance for outdoor use
• Quantum efficiency 72% @ 905 nm
• Chip size 11.7 × 9.3 × 0.27 mm
• Frame rate up to 700 fps
• Data interface MIPI CSI-2, 2 Gbit/s
• Control interface I2C
• Modulation frequency 0.625–31.25 MHz
• Power consumption 1 W
• Internal memory 128 × 8-bit EEPROM
• Resolution 320 × 240 pixels

The new ESPROS epc670 is now available from Neumüller Elektronik GmbH. Take advantage of this opportunity to equip your next robotics or sensor technology projects with state-of-the-art 3D time-of-flight technology. Our team of experts will be happy to advise you personally on possible applications, technical details, and integration.