, one of the world's leading LED
manufacturers, has established a new LED
design with the WICOP2 product family. The form factor of this design, Chip Scale Package, has many advantages. An extremely high color temperature homogeneity can be observed with a significantly smaller package size at the same time. Compared to previous designs in this performance class, the dimensions are reduced by around 50%, resulting in a reduction in area of around 75%. Thus, extremely compact and efficient LED modules
can be realized. The current package dimensions are 1.5mm x 1.5mm or 1.9mm x 1.9mm. Due to the direct SMD
mounting of the chip and the associated short thermal path, this design is thermally very robust and has extremely good service life values. In addition, the lack of bonding wires increases reliability.
The compact design also allows a simpler design of optical elements, since the light-emitting area has been minimized. Due to the reduction of package costs, this new innovative design is also a real economic alternative.