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NEWS: tof (time of flight)


7/14/2020
Cliff detection with 3D time-of-flight imager from ESPROS
Today's best robot vacuums are full of high-tech features. Connected to WiFi they can be controlled by smartphone and even via a voice assistant. The combination of many sensors and software allows to drive around obstacles, map the rooms and plan the most economic cleaning path...
8/29/2019
Distance measurement made easy with TOF range 611
With the TOF>range 611 of the Swiss photonic specialist Espros distances up to 15m can be measured...
6/18/2019
Miniature ToF imager TOF frame 611 with improved performance
For the 8x8 pixel miniature time-of-flight imager module TOF>frame 611 of the Swiss photonics specialist Espros the range could be increased from 2m to 3m by improved calibration and compensation algorithms. The module has...
5/7/2019
TOF CAM 635 - Easy and cost-effective introduction to TOF technology
The time-of-flight technology is gaining more and more importance in the field of 3D imaging. However, the development of a ToF camera requires extensive know-how regarding optics, illumination and signal processing. With the new TOF>cam 635 from the Swiss photonics specialist ESPROS Photonics Corporation, these time-consuming and cost-intensive hardware engineering tasks have already been solved and a cost-effective and powerful 3D time-of-flight camera module is available to the user...
1/3/2018
Time-of-Flight (ToF) Imager epc611
At the end of 2017, ESPROS Photonics AG introduced the new Time-of-Flight (ToF) Imager epc611. It has an 8x8 pixel CCD photodiode array and is available as usual in a chip-scale BGA package. The pixel size is 20um x 20um, resulting in an active area of ​​160um x 160um...
2/27/2017
Time-of-flight chip with 160 x 60 pixels
With the epc635, the Swiss semiconductor manufacturer ESPROS Photonics AG has launched another time-of-flight chip. This chip has a resolution of 160x60 pixels and is also based on BSI's own manufacturing process.
7/26/2016
Neumüller Electronics Experts at the SpectroNet Collaboration Forum Jena 2016
Don't miss the innovative presentations of our experts, Matthias Flack and Jonatan Klee, on the topics "Usability of Time-of-flight (TOF) camera chips for innovative evaluation kits and camera applications" and "Usability of UV-LEDs for harmless disinfection, air/water purification and food preservation" at this year's SpectroNet Forum.
4/7/2015
A New Generation of TOF Camera Chips
The announced TOF - Time of Flight Camera Chip of the Swiss semiconductor manufacturer ESPROS Photonics AG offers a higher performance and optimal application in various applications.

The TOF chip with its size of 9.7 mm x 8.7 mm and its 320 x 240 pixels (QVGA resolution) offers extensive application possibilities. The CSP (Chip Scale Package) results in a height of just 0.28 mm with a light-active area of 6.4 mm x 4.8 mm.
5/6/2013
3D Time-of-Flight Sensors
The epc600 is a monolithic, highly integrated photoelectric CMOS device for optical distance measurement and object recognition. The chip measures 2.65mm x 2.65mm and is based on the 3D 'Time-of-Flight' (TOF) principle.
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